JPH0262767U - - Google Patents
Info
- Publication number
- JPH0262767U JPH0262767U JP14128488U JP14128488U JPH0262767U JP H0262767 U JPH0262767 U JP H0262767U JP 14128488 U JP14128488 U JP 14128488U JP 14128488 U JP14128488 U JP 14128488U JP H0262767 U JPH0262767 U JP H0262767U
- Authority
- JP
- Japan
- Prior art keywords
- shaped
- wire rod
- repairing
- material layer
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005219 brazing Methods 0.000 claims 1
- 239000011888 foil Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 238000003466 welding Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 230000002950 deficient Effects 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14128488U JPH0262767U (en]) | 1988-10-28 | 1988-10-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14128488U JPH0262767U (en]) | 1988-10-28 | 1988-10-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0262767U true JPH0262767U (en]) | 1990-05-10 |
Family
ID=31406224
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14128488U Pending JPH0262767U (en]) | 1988-10-28 | 1988-10-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0262767U (en]) |
-
1988
- 1988-10-28 JP JP14128488U patent/JPH0262767U/ja active Pending
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